Experimental and Simulation Study of a High Current 1D Silicon Nanowire Transistor Using Heavily Doped Channels

Silicon nanowires have numerous potential applications, including transistors, memories, photovoltaics, biosensors and qubits [1]. Fabricating a nanowire with the required characteristics for a specific application, however, poses some challenges. For example, a major challenge is that, as the transistors dimensions are reduced, it is difficult to maintain a low off-current (Ioff) whilst simultaneously maintaining a high on-current (Ion). Some sources of this parasitic leakage current include quantum mechanical tunnelling, short channel effects and statistical variability [2, 3]. A variety of new architectures, including ultra-thin silicon-on-insulator (SOI), double gate, FinFETs, tri-gate, junctionless and gate all-around (GAA) nanowire transistors, have therefore been developed to improve the electrostatic control of the conducting channel. This is essential since a low Ioff implies low static power dissipation and it will therefore improve power management in the multi-billion transistors circuits employed globally in microprocessors, sensors and memories

Experimental and simulation study of 1D silicon nanowire transistors using heavily doped channels

The experimental results from 8 nm diameter silicon nanowire junctionless field effect transistors with gate lengths of 150 nm are presented that demonstrate on-currents up to 1.15 mA/m for 1.0 V and 2.52 mA/m for 1.8 V gate overdrive with an off-current set at 100 nA/m. On- to off-current ratios above 108 with a subthreshold slope of 66 mV/dec are demonstrated at 25 oC. Simulations using drift-diffusion which include densitygradient quantum corrections provide excellent agreement with the experimental results. The simulations demonstrate that the present silicon-dioxide gate dielectric only allows the gate to be scaled to 25 nm length before short-channel effects significantly reduce the performance. If high-K dielectrics replace some parts of the silicon dioxide then the technology can be scaled to at least 10 nm gatelength

Experimental and simulation study of 1D silicon nanowire transistors using heavily doped channels

Silicon nanowires have numerous potential applications, including transistors, memories, photovoltaics, biosensors and qubits [1]. Fabricating a nanowire with the required characteristics for a specific application, however, poses some challenges. For example, a major challenge is that, as the transistors dimensions are reduced, it is difficult to maintain a low off-current (Ioff) whilst simultaneously maintaining a high on-current (Ion). Some sources of this parasitic leakage current include quantum mechanical tunnelling, short channel effects and statistical variability [2, 3]. A variety of new architectures, including ultra-thin silicon-on-insulator (SOI), double gate, FinFETs, tri-gate, junctionless and gate all-around (GAA) nanowire transistors, have therefore been developed to improve the electrostatic control of the conducting channel. This is essential since a low Ioff implies low static power dissipation and it will therefore improve power management in the multi-billion transistors circuits employed globally in microprocessors, sensors and memories